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HDI printed circuit boards (High Density Interconnection)

Your projects require a high density of interconnections?
Our solution: HDI- printed circuit boards.

Our technical strenghts

  • Microvia via-filling
  • Registration of the layers with X-ray.
  • Insolation through LDI (Line of 70 microns)
  • Metallization ratio ≤ 1

Application types

  • Calculator
  • CPU card
  • Usage of fine pitch components

Precautions to keep in mind

  • Compliance with the installation rules
  • Plating ration microvia ≤ 1

Finishing

Finishing ENIG, Sn chemical.

Materials

Materials FR4 new generation, polymide.